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Snapdragon 670

Diperkenalkan pada Agustus 2018, Snapdragon 670 memiliki arsitektur yang sangat terintegrasi, termasuk CPU Qualcomm Kryo, Qualcomm Spectra ISP, Qualcomm AI Engine, dan modem Snapdragon X12 LTE, untuk pengalaman pengguna seluler berkualitas tinggi.

Bersama-sama, fitur-fitur ini membawa platform unggul dalam hal kecerdasan buatan (AI), kamera, dan multimedia. Sebagai bagian dari keluarga seri 600, ini juga unggul dalam hal masa pakai baterai yang lama.

Fitur Snapdragon 670

Spesifikasi Snapdragon 670

Qualcomm® Artificial Intelligence (AI) Engine

AIE GPU: Qualcomm® Adreno™ 615 GPU

Hexagon Processor: Qualcomm® Hexagon™ 685 Vector Processor

Cellular Modem

Modem Name: Qualcomm® Snapdragon™ X12 LTE modem

Peak Download Speed: 600 Mbps

Multi SIM: Dual SIM Dual VoLTE (DSDV)

Peak Upload Speed: 150 Mbps

Downlink QAM: Up to 256-QAM

Uplink QAM: Up to 64-QAM

Calling Services: VoLTE with SRVCC to 3G and 2G, Voice over Wi-Fi (VoWiFi) with LTE call continuity, HD and Ultra HD Voice (EVS)

Cellular Technology: LTE Broadcast, Qualcomm® Snapdragon™ All Mode, LTE TDD, WCDMA (DB-DC-HSDPA, DC-HSUPA), LTE FDD, TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE

Uplink Technology: Qualcomm® Snapdragon™ Upload+

Downlink Carrier Aggregation: 3x20 MHz carrier aggregation

Uplink Carrier Aggregation: 2x20 MHz carrier aggregation

Downlink LTE Category: LTE Category 12

Uplink LTE Category: LTE Category 13

Wi-Fi

Peak Speed: 867 Mbps

Wi-Fi Standards: 802.11ac Wave 2, 802.11a/b/g, 802.11n

Wi-Fi Spectral Bands: 2.4GHz, 5GHz

Channel Utilization: 20/40/80/160 MHz

MIMO Configuration: 2x2 (2-stream)

Peak QAM: 256 QAM

Wi-Fi Features: MU-MIMO, LTE/Wi-Fi antenna sharing, Dual-band simultaneous (DBS), Integrated baseband

Bluetooth

Bluetooth Version: Bluetooth 5.0

Bluetooth Speed: 2 Mbps

NFC

Near Field Communications: Supported

Location

Satellite Systems Support: Beidou, Galileo, GLONASS, GPS, QZSS, SBAS

USB

USB Version: USB 3.1, USB-C

CPU

CPU Clock Speed: Up to 2.0 GHz

CPU Cores: Qualcomm® Kryo™ 360 CPU, Octa-core CPU

CPU Architecture: 64-bit

Process

Process Technology: 10 nm

Camera

Image Signal Processor: Qualcomm Spectra™ 250 image signal processor, 14-bit, 2x Image Signal Processor (ISP)

Dual Camera, MFNR, ZSL, 30fps: Up to 16 MP

Single Camera, MFNR, ZSL, 30fps: Up to 25 MP

Single Camera: Up to 192 MP

Camera Features: Accelerated Electronic Image Stabilization

Slow Motion Video Capture: 1080p @ 120 FPS, 720p @ 240 FPS

Video Capture Formats: HEVC

Single Camera, MFNR: Up to 48 MP

Video Capture (30 FPS): 4K Ultra HD video capture

Video

Video Playback: Up to 4K Ultra HD Premium video playback @ 60 fps

Codec Support: H.264 (AVC), H.265 (HEVC), VP8, VP9

Video Software: Motion Compensated Temporal Filtering (MCTF)

Display

Max On-Device Display: FHD+

Max External Display: 4K Ultra HD

Display Pixels: 2560x1600

General Audio

Audio Technology: Qualcomm Aqstic™ audio technology, Qualcomm® aptX™ audio technology

Qualcomm® aptX™ audio playback support: Qualcomm® aptX™ Audio, Qualcomm® aptX™ HD

GPU

GPU Name: Qualcomm® Adreno™ 615 GPU

Security Support

Security Features: Qualcomm® Content Protection, Qualcomm® Mobile Security, Qualcomm® Processor Security

Charging

Qualcomm® Quick Charge™ Technology Support: Qualcomm® Quick Charge™ 4+ technology

Daftar HP Snapdragon 670

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