Sebagai salah satu prosesor seluler paling mutakhir yang pernah dibuat, platform seluler Qualcomm Snapdragon 820 dengan X12 LTE mendukung konektivitas, grafis, fotografi, daya, dan efisiensi baterai terbaik.
Masih sama dengan Snapdragon 810, platform baru ini menggunakan CPU berarsitektur 64-bit dengan empat inti (quad-core). Perbedaannya, Snapdragon 820 sudah tidak menggunakan CPU berbasiskan ARM. Qualcomm menggantinya dengan CPU buatan sendiri yang dinamakan Kryo. CPU tersebut tersedia dengan kecepatan hingga 2,2 GHz per intinya.
Fitur Snapdragon 820
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X12 LTE: Industry leading connectivity with LTE download speeds of up to 600 Mbps, multi-gigabit 802.11ad, and 2×2 802.11ac Wi-Fi
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New Qualcomm® Kryo™ CPU: Delivering maximum performance and low power consumption, Kryo is QTI’s first custom 64-bit quad-core CPU, manufactured in advanced 14nm FinFET LPP process
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New Qualcomm® Adreno™ 530 GPU: Up to 40% better graphics and compute performance for improved visual fidelity while reducing power consumption
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Qualcomm Spectra™ 14-bit dual image signal processors (ISPs) deliver high resolution DSLR-quality images using heterogeneous compute for advanced processing and additional power savings
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New Qualcomm® Hexagon™ 680 DSP includes Hexagon Vector eXtensions (HVX) and Sensor Core with Low Power Island for always-on sensor processing
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New Touch-To-Track: Recognize and track multiple objects on screen using advanced computer vision
Spesifikasi Snapdragon 820
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Cellular Modem | Modem Name: Qualcomm® Snapdragon™ X12 LTE modem Peak Download Speed: 600 Mbps Multi SIM: LTE Dual SIM Dual Standby (DSDS) Peak Upload Speed: 150 Mbps Downlink QAM: Up to 256-QAM Uplink QAM: Up to 64-QAM Calling Services: Voice over Wi-Fi (VoWiFi) with LTE call continuity, HD Voice over 3G and VoLTE Cellular Technology: LWA, LTE Broadcast, LTE TDD, WCDMA (DB-DC-HSDPA, DC-HSUPA), LTE FDD, LTE-U, TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE Uplink Technology: Qualcomm® Snapdragon™ Upload+ Downlink Carrier Aggregation: 3x20 MHz carrier aggregation Uplink Carrier Aggregation: 2x20 MHz carrier aggregation Downlink LTE Category: LTE Category 12 Uplink LTE Category: LTE Category 13 |
Wi-Fi | Peak Speed: 867 Mbps Wi-Fi Standards: 802.11ad, 802.11ac Wave 2, 802.11a/b/g, 802.11n Wi-Fi Spectral Bands: 2.4GHz, 5GHz, 60GHz Channel Utilization: 20/40/80 MHz MIMO Configuration: 2x2 (2-stream) Peak QAM: 256 QAM Wi-Fi Features: MU-MIMO, Multi-gigabit Wi-Fi |
Bluetooth | Bluetooth Version: Bluetooth 4.1 |
NFC | Near Field Communications: Supported |
Location | Satellite Systems Support: Beidou, Galileo, GLONASS, GPS Location Support: Qualcomm® Location Global Emergency Services Support: Assisted GPS, OTDOA (LTE-based positioning) Advanced Location Features: Sensor-assisted Navigation, Low Power Geofencing and Tracking, Pedestrian Navigation |
USB | USB Version: USB 3.0, USB 2.0 |
CPU | CPU Clock Speed: Up to 2.2 GHz CPU Cores: Qualcomm® Kryo™ CPU, Quad-core CPU CPU Architecture: 64-bit |
Process | Process Technology: 14 nm |
Camera | Image Signal Processor: Qualcomm Spectra™ image signal processor, 14-bit, 2x Image Signal Processor (ISP) Single Camera: Up to 28 MP Camera Features: Qualcomm® Clear Sight™ camera features Video Capture (30 FPS): 4K Ultra HD video capture |
Video | Video Playback: Up to 4K Ultra HD video playback Codec Support: H.264 (AVC), H.265 (HEVC) |
Display | Max On-Device Display: 4K Ultra HD Max External Display: 4K Ultra HD Display Pixels: 3840x2160 |
General Audio | Audio Technology: Qualcomm Aqstic™ audio technology |
GPU | GPU Name: Qualcomm® Adreno™ 530 GPU API Support: OpenGL® ES 3.2, OpenCL™ 2.0 full, Vulkan® 1.0, DX11.2 |
Security Support | Security Features: Malware Protection, Qualcomm® Content Protection, Qualcomm® Device Lock Authentication, Qualcomm® Fingerprint Sensors, Qualcomm® Mobile Security, Qualcomm® Processor Security |
Charging | Qualcomm® Quick Charge™ Technology Support: Qualcomm® Quick Charge™ 3.0 technology Qualcomm® WiPower™ Support: Qualcomm® WiPower™ wireless charging |
Memory | Memory speed: 1866MHz Memory Type: LPDDR4, Dual-Channel |
Storage | eMMC: eMMC 5.1 UFS: UFS 2.0 SD: SD 3.0 (UHS-I) |